Stepped G/F board
Board thickness:rn≥2.0mm
G/F thickness:≤1.6mm±0.1mm
G/F tolerance:±0.05mm
Layer count:≤44 layers
Embedded coin PCB
Structure:Partially / fully embedded
Min coin size:2*2(mm)
Min coin thickness:0.5mm
Flatness between coin and base material:≤0.075mm
Patrially embedded AIN board
Material:AIN
Embedded Ceramic size:20*20(mm)
Professional technical support for thermal management:
IC test board
Max board thickness:6.0mm
Max aspect ratio:25:1
Max gold thickness:80 u''
Warpage:≤4‰
Partially embedded AIN board
Material:AIN
Embedded Ceramic size:20*20(mm)
Professional technical support for thermal management:
Address: No.389 Shetang road, Economic and Technological Development Zone, Changsha, China.
TEL: 0731-82786288-6818
Email: sales02@mtlpcb.com
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