IC test board
Max board thickness:6.0mm
Max aspect ratio:25:1
Max gold thickness:80 u''
Warpage:≤4‰
High-density multilayer board
Min line width/space:3mil
Min hole size:0.2mm
Impedance control tolerance:±10%
Max layer count:56
Ceramic based PCB
Min hole size:0.1mm
Metallization Process:DPC, DBC, COB
Finish board thickness:15um-200um
Surface finish:ENIG, Immersion silver
Blind & Buried vias PCB
Layer count:12 layer
Aspect ratio:12
Min hole size:0.15mm
Line width/space:4/4mil
Blind vias:1-2/1-3/1-4/1-5
Partially embedded AIN board
Material:AIN
Embedded Ceramic size:20*20(mm)
Professional technical support for thermal management:
Rigid-flex PCB
Flexiable layers:8
Max layer count:16
Min line width/space:4mil
Address: No.389 Shetang road, Economic and Technological Development Zone, Changsha, China.
TEL: 0731-82786288-6818
Email: sales02@mtlpcb.com
Copyright 2021 ? MULTILAYER PCB TECHNOLOGY CO., LTD ALL Rights Reserved 湘ICP備19019552號(hào)-1
Link Us on Verified by